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Keywords [ structural bonding adhesive ] match 97 Products.

Momentive TSE3975 for Electronic Sealants and Potting as Silicone Adhesive

Price: CN¥329.81/pieces >=1 pieces

Main Raw Material	Silicone
Appearance	Flowable Paste
Cure Mechanism	Moisture-curing
Volume Resistivity	2.0 × 10¹⁵Ω·cm
Dielectric Strength	23kV/mm

Shin-Etsu KBM-603 Diamino-Functional Amino Silane Coupling Agent for Enhanced Coating Adhesion with High Reactivity

Price: 467 MOQ: 1

Brand	Shin-Etsu
Model	KBM-603
Specifications	1kg
Category	Silane Coupling Agent
Flash Point (°C)	128

Momentive ME121 Primer for Condensation Cure Silicone Sealant Adhesion

Price: CN¥855.76/barrels 1-99 barrels

Appearance	Pale Yellow Transparent
Specific Gravity (23°C)	0.86
Viscosity (23°C)	3mPa·s {cP}
Non-volatile (150°C,1h)	16%
Solvent	Toluene, IPA, N-Butanol

RTV159 Momentive Silicone Adhesive For Electronic Potting And Sealing

Price: CN¥341.54/pieces 1-49 pieces MOQ: 1

Color	RED
Chemical Base	Acetoxy-functional Silicone Polymer
Curing Mechanism	Room Temperature Vulcanization (RTV) Via Atmospheric Moisture
Operating Temperature	-60°C To +205°C
Temperature Resistance	Up To +205°C (continuous)

TSE3854DS Momentive Adhesive Sealant Electronic Flame Retardant

Price: CN¥64.41/pieces 1-99 pieces MOQ: 1

Names	Momentive TSE3854DS
Appearance (Uncured)	Non-flowable Paste
Tack-Free Time	15 Min
Density (Cured)	1.33 G/cm³
Hardness (Type A)	45

Araldite AW4859/HW4859 Epoxy Paste with 25 MPa Shear Strength

Price: CN¥591.57/pieces 1-49 pieces

Product Name	Araldite AW4859/HW4859
Colour	Black(Mixed Adhesive)
Specific Gravity	Approx. 1.1(Mixed Adhesive)
Viscosity At 25°C	Thixotrope(Mixed Adhesive)
Lap Shear Strength At 23°C	> 25 MPa

Cemedine LN-2250 Multipurpose Epoxy Resin

Price: CN¥665.48/pieces 1-99 pieces MOQ: 1

CAS No.	Cemedine
Product Name	Cemedine LN-2250
Main Raw Material	EPOXY
Characteristic	Weather And Heat Resistance
Color	Transparent

Cemedine Super 8008 Electronic Sealant

Price: CN¥175.29/pieces 1-99 pieces MOQ: 1

CAS No.	Cemedine
Product Name	Cemedine Super X 8008
Other Names	Cemedine Super X
Classification	Other Adhesives
Main Raw Material	Epoxy

Araldite AY 103-1 / Hardener HY 991 Low Viscosity Two-Component Epoxy Adhesive System

Price: 29710 MOQ: 1

Specific Gravity	Ca. 1.0
Gel Time At 25°C (A8), Min	Gel Time At 25°C (A8), Min
/ Lap Shear At 25°C (A501)	>14 MPa
Specification	AW103-1:25kg/drum HY991:20KG/drum
Packaging Details	25kg*2+20KG

Shin-Etsu KR-510 Epoxy Resin Modifier for Enhanced Heat Resistance and Weather Resistance with High-Temperature Stability

Price: 888 MOQ: 1

Brand	Shin-Etsu
Model	KR-510
Specifications	1kg
Category	Epoxy Resin
Highlight	Enhanced Heat Resistance Epoxy Resin Modifier , Weather Resistance Organosilicon Oligomer , High-Temperature Stability Silicone Adhesive

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structural bonding adhesive

Silicone Adhesive

Araldite Epoxy

Dowsil Adhesive

Shinetsu Silicone

Molykote Grease

Loctite Adhesive

Cemedine Adhesive

Momentive Silicone

Electrolube Conformal Coating

Silicone Oil