Dowsil CN-8760 Thermally Conductive Encapsulant Gray Elastomer Moderate Thermal Conductivity

Dowsil CN-8760 Thermally Conductive Encapsulant Gray Elastomer Moderate Thermal Conductivity

Product Overview​​
Dowsil CN-8760 is a two-part, thermally conductive encapsulant designed for applications requiring efficient heat dissipation and electrical insulation. This gray elastomer offers a low viscosity formulation, easy mixing, and room temperature curing, making it suitable for a wide range of electronic and electrical assembly applications.

​​Product Description​​
Dowsil CN-8760 is a versatile encapsulant that cures to a flexible elastomer without exotherm, ensuring consistent performance regardless of the thickness or confinement of the application. It is primerless, requiring only proper surface cleaning for adhesion, and provides excellent thermal conductivity to aid in heat dissipation. The product is UL 94 V0 certified, ensuring compliance with flammability standards, and offers a balanced combination of mechanical and electrical properties for reliable performance in demanding environments.

​​Special Properties​​
Dowsil CN-8760 stands out for its 1:1 mixing ratio, which simplifies the manufacturing process and allows for some variation in dispense equipment. It cures at room temperature or with heat acceleration, providing flexibility in processing. The cured material has a Shore A durometer of 52, offering a balance between hardness and flexibility. Its thermal conductivity of 0.66 W/mK ensures effective heat transfer, while its low dissipation factor and high dielectric strength make it suitable for electrical insulation applications. The product is also compatible with a wide range of materials, though care should be taken to avoid inhibitors such as organotin compounds and sulfur-containing materials.

​​Application Scenarios​​
Dowsil CN-8760 is commonly used in power modules, adaptors, inverters, transformers, ballasts, sensors, and electric control units. Its thermal conductivity and electrical insulation properties make it ideal for protecting sensitive electronic components while ensuring efficient heat dissipation. The product is also suitable for applications requiring primerless adhesion and fast processing times, such as in high-volume manufacturing environments.