Dowsil SC102 1KG Product Introduction​

Product Attributes​​
Dowsil SC102 is a white, non-curing, and non-flowing thermally conductive compound. It is a one-part silicone-based material, heavily filled with heat-conductive metal oxides, designed to provide efficient thermal transfer without the need for ovens or curing processes.

Product Overview​​
Dowsil SC102 is engineered to facilitate efficient heat dissipation in electronic assemblies, particularly in computer, power supply, and automotive applications. Its grease-like consistency allows for easy application, and it maintains a positive seal between heat-generating components and heat sinks, enhancing overall thermal management. This compound is ideal for applications where thermal conductivity, ease of use, and reliability are critical.

 Special Product Attributes​​
One of the standout features of Dowsil SC102 is its moderate thermal conductivity, which ensures effective heat transfer while maintaining stability under high temperatures. The compound exhibits a low bleed rate (0.14%) and a high non-volatile content (99.7%), ensuring minimal material loss over time. Its dielectric strength (50 volts/mil or 2 kV/mm) and volume resistivity (2E+16 Ohm-cm) make it suitable for electrical insulation applications. Additionally, its viscosity of 29,000 cP (or 29 Pa-sec) allows for easy application via screen printing or spatula spreading, while its thermal resistance at 40 psi (0.62 °C-cm²/W) ensures efficient heat transfer with minimal thermal barrier.

Application Scenarios​​
Dowsil SC102 is widely used in the electronics industry for thermal management in PCB assemblies. It is particularly effective in cooling system modules for computers, power supplies, and automotive electronics. The compound is ideal for applications requiring a reliable thermal interface material that can be easily applied and maintained without curing. According to industry sources, Dowsil SC102 is also suitable for use in compact consumer devices, where space constraints and high heat generation necessitate efficient thermal management solutions.