Dowsil SE 4450 Thermally Conductive Adhesive​ For Electronics Bonding

Dowsil SE 4450 Thermally Conductive Adhesive​

Product Overview​

Dowsil SE 4450​​ is a ​​1-part, gray, flowable thermally conductive adhesive​​ designed for high-reliability bonding in electronics. Key attributes include:

​​Type​​: Heat-cure silicone elastomer

​​Form​​: Non-slumping liquid with controlled flow

​​Color​​: Gray

​​Thermal Conductivity​​: 1.92 W/m·K (3.322 BTU/hr·ft·°F)

​​Cure Time​​: 30 minutes at 150°C (302°F)

​​Shelf Life​​: 6 months (stored below 4°C)

Product Introduction​​

SE 4450 is engineered to address thermal management challenges in compact, high-power electronic systems. As a ​​solvent-free, addition-cure adhesive​​, it eliminates voids and ensures rapid, uniform heat transfer from components like power supplies, inkjet printheads, and ICs to heat sinks. Its ​​high tensile strength (1060 psi / 7.3 MPa)​​ and ​​elongation (45%)​​ balance structural integrity with flexibility, accommodating thermal cycling and mechanical stress. The one-component formula simplifies processing, while its ​​no-mix application​​ reduces errors in high-volume manufacturing.

Enhanced Properties

Accelerated Curing​​: Achieves full adhesion in 30 minutes at 150°C, enabling faster production cycles.

Low Outgassing​​: Free of solvents and volatile organic compounds (VOCs), ensuring cleanliness in sealed environments.

​​Broad Substrate Compatibility​​: Bonds metals, ceramics, and filled plastics without primers (though surface preparation is recommended).

Electrical Insulation​​: UL 94 V-0 rated for flame retardancy, with a dielectric strength of 575 V/mil (22 kV/mm).

​​Thermal Stability​​: Maintains performance from -45°C to 200°C (-49°F to 392°F), withstanding harsh operating conditions.

Application Scenarios​​

While specific case studies for SE 4450 are proprietary, its attributes align with common industrial uses:

​​Power Electronics​​: Bonding IGBT modules, DC-DC converters, and power transistors in servers and renewable energy systems.

​​Automotive​​: Securing components in EV battery modules and infotainment systems exposed to vibration and temperature extremes.

LED Lighting​​: Thermal coupling of LED chips to substrates to prevent overheating and extend lifespan.

​​Consumer Electronics​​: Repairing or retrofitting heat sinks in laptops, gaming consoles, and wearables.