February 27, 2026
Dow SYLGARD™ 184 Silicone Elastomer
Delivering Transparent, Flexible Protection for High-Reliability Electronic Encapsulation
As electronic devices become increasingly sophisticated and are deployed in more demanding environments, the performance requirements for encapsulation materials are rising accordingly. Dow’s SYLGARD™ 184 Silicone Elastomer, a two-part silicone system, is gaining prominence as a preferred potting and encapsulating material across consumer electronics, industrial controls, and beyond, thanks to its exceptional clarity, superior dielectric properties, flexible curing options, and broad operating temperature range.
Core Features & Benefits
SYLGARD™ 184 is a transparent liquid potting compound with a moderate mixed viscosity (3500 cP) and good flowability, enabling it to thoroughly fill fine gaps between complex components. Upon curing, it forms a soft elastomer (Shore A Hardness 43) that effectively buffers thermal and mechanical stress, safeguarding delicate circuits and components.
The material offers versatile curing schedules, including room temperature (approximately 48 hours at 25°C) and heat-accelerated options, with heat dramatically speeding up the process (e.g., just 10 minutes at 150°C), providing high flexibility for production processes. Its high transparency allows for easy in-process inspection and post-assembly troubleshooting.
Electrically, SYLGARD™ 184 offers excellent insulation (Dielectric Strength 19 kV/mm, Volume Resistivity 2.9E+14 ohm*cm) and a low dielectric constant. With a UL-recognized Relative Thermal Index (RTI) of 150°C, it ensures long-term reliability even in harsh environments involving high temperature and humidity.
Broad Application Spectrum
Based on its comprehensive properties, SYLGARD™ 184 is well-suited for a variety of electronic protection applications:
Repairability & Process Compatibility
Unlike many rigid epoxy resins, cured SYLGARD™ 184 elastomer can be selectively cut and removed using tools, enabling the repair of defective electronic units and significantly reducing manufacturing and after-sales maintenance costs.