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Watch: Elastic Adhesive Cemedine Super X 8008LL For Multi Material Bonding Showcase

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December 08, 2025
Category Connection: セメディンの接着剤
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#エポキシ樹脂接着剤 #エポキシ接着剤 #エポキシ樹脂セメジン接着剤
Brief: Here’s a fast, informative look at what this solution does and how it behaves. Watch our showcase to see the Cemedine Super X 8008LL elastic adhesive in action, demonstrating its rapid curing and flexible bonding capabilities across various materials like metals, plastics, and electronics in real-world industrial applications.
Related Product Features:
  • Single-component, moisture-curing elastic adhesive for industrial use with no mixing required.
  • Rapid initial curing in 10-30 minutes and achieves full cure within 24 hours.
  • Solvent-free formulation ensures safety and compliance with RoHS/REACH standards.
  • Exceptional elasticity with Shore A 60 hardness and 200% elongation at break.
  • Operates reliably across a wide temperature range from -60°C to +120°C.
  • Non-sag viscosity (85 Pa*s) allows for precise application on vertical surfaces.
  • Resists thermal cycling, humidity, and is free of corrosive low-molecular siloxanes.
  • Suitable for bonding diverse materials including metals, plastics, rubber, ceramics, and wood.
よくある質問:
  • What is the curing time for Cemedine Super X 8008LL?
    The adhesive has an initial set time of 10-30 minutes and achieves a full cure within 24 hours under standard conditions.
  • Which materials can be bonded with this elastic adhesive?
    It is compatible with a wide range of materials including metals, plastics, rubber, ceramics, and wood, making it ideal for multi-material bonding.
  • Is the Cemedine Super X 8008LL safe for electronic applications?
    Yes, it is free of low-molecular siloxanes (D3-D10) to prevent corrosion, making it suitable for waterproof sealing and component fixation in electronics.
  • What temperature range can this adhesive withstand?
    It maintains elasticity and performance across a broad service temperature range from -60°C to +120°C, resisting thermal cycling and humidity.
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