Dow Chemical Launches Military-Grade DOWSIL™ 3145 RTV Sealant, Redefining Reliability Standards for Electronics​

September 2, 2025

Latest company news about Dow Chemical Launches Military-Grade DOWSIL™ 3145 RTV Sealant, Redefining Reliability Standards for Electronics​

Breakthrough in Material Science
Amid growing demand for miniaturized electronics and extreme-environment applications, Dow Inc. (NYSE: DOW), a global leader in material science with 130+ years of innovation, introduces DOWSIL™ 3145 RTV one-part silicone. This gray adhesive/sealant meeting MIL-A-46146 specifications is revolutionizing sealing solutions for aerospace, automotive electronics, and industrial equipment.

Core Performance: Redefining Industry Standards

  1. Engineered Performance without Mixing
    As a polydimethylsiloxane-based material, its 121g/min extrusion rate (TDS data) and zero slump (0.1in/0.2cm) enable precise vertical application. Achieving >90% strength within 24-72 hours after 78-minute tack-free time (25°C) dramatically reduces production downtime.

  2. Extreme Environment Stability
    DSC tests confirm elasticity retention at -42°C (TDS hardening transition data). Operating range (-45 to 200°C) coupled with 1035psi tensile strength and 670% elongation (TDS Typical Properties) ensures sealing integrity under thermal shock.

  3. Military-Grade Endorsement
    MIL-A-46146 Group II/III, TY I certification (TDS Mil Spec) validates performance against vibration, humidity, and salt spray. UL 94 recognition further expands consumer electronics applications.

Productivity Revolution: Every Drop Reduces Cost
"Conventional thermal curing consumes 23% of production line energy," states Dow's Electronic Materials Technical Director. "DOWSIL™ 3145 eliminates oven investments, with 10-120 minute handling time (TDS Description) boosting line efficiency by 40%."
Accelerated curing below 60°C benefits cycle-sensitive operations like automotive electronics. Twelve-month shelf life (25°C) and diverse packaging (100ml syringes to 200kg pails) optimize inventory management.

Applications: From Microchips to Spacecraft

Sustainability Commitment
Dow's Product Stewardship (TDS documentation) governs the lifecycle: 96.2% non-volatile content reduces VOC emissions, nitrogen-purged packaging minimizes waste. Global technical teams on dow.com deliver customized solutions, actualizing "Material Science for Sustainable Development".

Access Information
Visit dow.com/electronics for full TDS and SDS documents, or contact local Dow technical centers for samples.

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