View Non Curing Heat Transfer Paste Electrolube HTC Demo

Inne filmy
December 08, 2025
Category Connection: Powłoka ochronna Electrolube
Brief: In this video demonstration, you will see how Electrolube HTC Non-Curing Heat Transfer Paste effectively manages thermal performance in electronic applications. Watch as we showcase its application between components and heat sinks, highlighting its stable, non-hardening properties and excellent heat dissipation capabilities across a wide temperature range.
Related Product Features:
  • Non-curing formulation allows for easy rework and maintenance without hardening over time.
  • Thermal conductivity of 0.7 W/m.K ensures efficient heat transfer from electronic components to heat sinks.
  • Operates reliably across a broad temperature range from -50°C to +130°C.
  • High electrical insulation with volume resistivity of 1x10^14 Ohms-cm and dielectric strength of 42 kV/mm.
  • Excellent thermal stability with minimal weight loss (<1.0%) after 96 hours at 100°C.
  • Non-silicone oil base prevents silicone migration issues, making it suitable for sensitive electronics.
  • Permittivity of 4.2 at 1GHz supports use in high-frequency electronic environments.
  • Suitable for various applications including power electronics, CPUs, LED lighting, and automotive systems.
Pytania:
  • What is the main advantage of Electrolube HTC's non-curing formulation?
    The non-curing formulation allows for easy rework and maintenance of components without hardening, ensuring long-term flexibility and reliability in thermal management applications.
  • What temperature range can Electrolube HTC operate within?
    Electrolube HTC operates reliably across a broad temperature range from -50°C to +130°C, making it suitable for various electronic environments.
  • How does Electrolube HTC ensure electrical safety in sensitive electronics?
    It offers high electrical insulation with a volume resistivity of 1x10^14 Ohms-cm and a dielectric strength of 42 kV/mm, reducing risks in sensitive electronic applications.