Property | Value |
---|---|
Type | One-Part Heat Curing Epoxy Adhesive |
Base Resin | Epoxy resin |
Appearance | Light brown |
Viscosity (23 °C) | 100 Pa*s |
Density | 1.16 g/cm³ |
Standard Curing Conditions | 110℃*60min or 120℃*30min |
Tensile Shear Strength | 16.8 MPa |
T-Peel Strength | 1.18 N/mm |
Hardness (Shore D) | 85 |
Glass Transition Temperature (Tg) | 140℃ |
Volume Resistivity | 2.6*10¹⁵ Ω*cm |
Dielectric Constant (100Hz) | 4.5 |
Dielectric Loss Tangent (100Hz) | 0.011 |
Storage Temperature | 0~10℃ |
Capacity | 1kg |
Cemedine EP160 is a one-component, heat-curing epoxy adhesive specifically engineered for high-temperature environments. As a pre-mixed formulation, it eliminates measuring and mixing errors, ensuring consistent bonding performance. Its unique epoxy resin base provides exceptional thermal stability, making it ideal for applications demanding prolonged heat resistance.
EP160's core advantage lies in its 140 °C glass transition temperature (Tg), significantly higher than standard epoxy adhesives (e.g., EP138: 122°C, EP106NL: 91°C). This enables reliable performance under continuous thermal stress. The adhesive maintains 16.8 MPa tensile shear strength after curing, with a balanced viscosity (100 Pa*s) for controlled application. Electrical properties, including 2.6 *10¹⁵ Ω*cm volume resistivity and low dielectric loss, support use in electronic components.
Verified industrial applications include:
Data source: Industrial adhesive case studies from Cemedine-certified partners (2023).
We are Shenzhen Huazhisheng New Material Technology Co., Ltd., a professional industrial adhesives and sealants supplier based in China since 2018. we serve global markets: Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).
we supply high-performance adhesives and sealants from global leaders including: Cemedine, Dow Corning, Shin-Etsu, Araldite, and Momentive,etc.
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