Thermal Grease Shin-Etsu X-23-7921-5 For High Performance Processors

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MOQ
CN¥3,002.16/kilograms 1-49 kilograms
Price
Thermal Grease Shin-Etsu X-23-7921-5 For High Performance Processors
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Features
Specifications
CAS No.: ShinEtsu
Other Names: ShinEtsu X-23-7921-5
Main Raw Material: Thermal Interface Material
Usage: Construction, Fiber & Garment, Footwear & Leather, Packing, Transportation, Woodworking
Type: Thermal Interface Material
Product Name: ShinEtsu X-23-7921-5
Package: 1kg/Piece
Color: Transparent
Hardness: Soft To Hard
Adhesion: Strong
Curing Method: Heat Or Room Temperature
Chemical Resistance: Excellent
Temperature Resistance: High
Product Type: Silicone
Shelf Life: 1 Year
Electrical Insulation: High
Form: Liquid
Water Resistance: Excellent
Highlight:

Shin-Etsu X-23-7921-5

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X-23-7921-5 Thermal Grease

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Shin-Etsu Thermal Grease

Basic Infomation
Place of Origin: Japan
Brand Name: ShinEtsu
Certification: TDS,SDS,Rohs
Model Number: ShinEtsu X-23-7921-5
Payment & Shipping Terms
Packaging Details: 1 piece
Delivery Time: 5-8days
Payment Terms: T/T,L/C,D/A,D/P,Western Union,MoneyGram
Supply Ability: 1000Piece
Product Description

Shin-Etsu X-23-7921-5 Thermal Grease for High-Performance Processors

 

Product Introduction: Shin-Etsu X-23-7921-5 Thermal Grease

Basic Properties

Shin-Etsu X-23-7921-5 is a non-solvent thermal interface material designed for high-performance microprocessors. It fills air gaps between processors and heat sinks to enhance thermal efficiency, featuring high thermal conductivity (>6.0 W/m·K) and low thermal resistance (<7.0 mm²·K/W). The gray paste has a viscosity of 360 Pa·s at 25°C.

 


Product Description

Developed by Shin-Etsu Chemical, X-23-7921-5 minimizes interfacial thermal resistance by evenly coating processor-heat sink interfaces. Its formulation achieves a bond line thickness (BLT) of 25μm at 20psi, with minimal volatility (0.44% after 24hrs at 50°C). Available in syringes, cartridges, and bulk packaging for manual or automated applications.

 


Key Features

  • High Thermal Conductivity: >6.0 W/m·K, far surpassing air (0.027 W/m·K).
  • Low Thermal Resistance: <7.0 mm²·K/W at 20psi.
  • Stability: Specific gravity 2.5 with low volatility for long-term reliability.
  • Precision Compatibility: BLT maintained at 25~41μm under 5.2~52.2psi pressure.

Applications

Applications include CPU/GPU cooling, servers, automotive electronics, and high-power LED modules. Its low thermal resistance suits thin-profile devices (e.g., laptops) and industrial equipment requiring sustained high-temperature operation.

 


Technical Specifications

Property Value Unit
Viscosity @25°C 360 Pa·s
Thermal Conductivity >6.0 W/m·K
Thermal Resistance @20psi <7.0 mm²·K/W
Bond Line Thickness @20psi 25 μm
Volatile Content (50°C/24h) 0.44 %
Specific Gravity 2.5 -

1. Who are we?

We are Shenzhen Huazhisheng New Material Technology Co., Ltd., a professional industrial adhesives and sealants supplier based in China since 2018. we serve global markets: Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).

2. What products do you offer?

we supply high-performance adhesives and sealants from global leaders including:

Cemedine, Dow Corning, Shin-Etsu, Araldite, and Momentive,etc.

 

3. How do you guarantee product quality?

Quality assurance through:

Mandatory pre-production samples approval

Final inspection by QC team before shipment

International certifications: SGS, UL, FDA, RoHS, REACH

 

4. Why choose us over other suppliers?

Reliable Supply:Authentic products from top manufacturers

Expert Support:Technical guidance for product selection

Global Compliance:Certifications meeting target market standards

Efficient Service:Customized solutions & professional support

 

5. What services do you provide?

Delivery​:EXW/FOB/CIF

Payment​:USD/EUR/CNY/HKD via T/T, L/C

Support​:Technical consultation & logistics coordination

Thermal Grease Shin-Etsu X-23-7921-5 For High Performance Processors 0

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Contact Person : ouyang
Tel : +86 13510063180
Fax : 86-0769-82622296
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