Shin-Etsu X-23-7921-5 Thermal Grease for High-Performance Processors
Product Introduction: Shin-Etsu X-23-7921-5 Thermal Grease
Shin-Etsu X-23-7921-5 is a non-solvent thermal interface material designed for high-performance microprocessors. It fills air gaps between processors and heat sinks to enhance thermal efficiency, featuring high thermal conductivity (>6.0 W/m·K) and low thermal resistance (<7.0 mm²·K/W). The gray paste has a viscosity of 360 Pa·s at 25°C.
Developed by Shin-Etsu Chemical, X-23-7921-5 minimizes interfacial thermal resistance by evenly coating processor-heat sink interfaces. Its formulation achieves a bond line thickness (BLT) of 25μm at 20psi, with minimal volatility (0.44% after 24hrs at 50°C). Available in syringes, cartridges, and bulk packaging for manual or automated applications.
Applications include CPU/GPU cooling, servers, automotive electronics, and high-power LED modules. Its low thermal resistance suits thin-profile devices (e.g., laptops) and industrial equipment requiring sustained high-temperature operation.
Property | Value | Unit |
---|---|---|
Viscosity @25°C | 360 | Pa·s |
Thermal Conductivity | >6.0 | W/m·K |
Thermal Resistance @20psi | <7.0 | mm²·K/W |
Bond Line Thickness @20psi | 25 | μm |
Volatile Content (50°C/24h) | 0.44 | % |
Specific Gravity | 2.5 | - |
1. Who are we?
We are Shenzhen Huazhisheng New Material Technology Co., Ltd., a professional industrial adhesives and sealants supplier based in China since 2018. we serve global markets: Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).
2. What products do you offer?
we supply high-performance adhesives and sealants from global leaders including:
Cemedine, Dow Corning, Shin-Etsu, Araldite, and Momentive,etc.
3. How do you guarantee product quality?
Quality assurance through:
Mandatory pre-production samples approval
Final inspection by QC team before shipment
International certifications: SGS, UL, FDA, RoHS, REACH
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Reliable Supply:Authentic products from top manufacturers
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