Dowsil Tc-6020 is Two-Component Heat Conductive Potting

Product Simple Attributes

Color: Mixed gray Form: Two component liquid silicone rubber (A/B ratio 1:1) Thermal conductivity: 2.72 W/m · K Viscosity: 10800 cP for component A/9960 cP for component B before mixing Curing method: room temperature curing or heating accelerated curing (60-100 ° C)

Product Introduction​​

DOWSIL™ TC-6020 is a two-component, gray-colored silicone elastomer designed for encapsulating and protecting PCB assemblies in harsh environments. Its 1:1 mix ratio by weight offers manufacturing flexibility, enabling both room-temperature and heat-accelerated curing. This thermal encapsulant combines high thermal conductivity (2.72 W/m·K) with excellent dielectric properties, making it ideal for applications requiring both heat dissipation and electrical insulation.

​​Special Attributes​​

​​Dual-Cure Flexibility​​: Cures at ​​60°C (T90=23分钟)​​ or ambient temperature, accelerating production cycles.

Low Viscosity Mix​​: Post-mix viscosity of ​​1,0640 cP​​ ensures easy dispensing into tight spaces.

​​High Adhesion​​: Delivers ​​40.5 psi lap shear strength to aluminum​​, preventing delamination under thermal stress.

​​Long-Term Stability​​: Maintains elasticity from ​​-45°C to 200°C​​, withstanding thermal cycling and mechanical shock.

​​Low Bleed & Shrinkage​​: Minimal yellowing or void formation after curing for reliable long-term performance.

Application Scenarios​​

DOWSIL™ TC-6020 is validated for use in:

​​Industrial Power Modules​​: Encapsulation of IGBTs and power semiconductors (as per TDS specifications).

​​Automotive Control Units​​: Protecting electronic systems in EVs and hybrid vehicles from vibration and temperature extremes².

​​LED Lighting Systems​​: Thermal management for high-brightness LEDs³.

​​Renewable Energy Equipment​​: Solar inverters and wind turbine power electronics⁴