Momentive YG6111 Semiconductor Thermal Joint Dielectric Compound

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MOQ
CN¥273.84/barrels 1-99 barrels
Price
Momentive YG6111 Semiconductor Thermal Joint Dielectric Compound
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Features
Specifications
Main Raw Material: Silicone
Appearance: White
Specific Gravity (25°C): 2.45
Penetration: 310(JIS K 2220)
Thermal Conductivity: 0.84W/m·K
Dielectric Constant (60Hz): 5.0
Dissipation Factor (60Hz): 0.006
Specifications: 1kg
Usage: Construction, Fiber & Garment, Footwear & Leather, Packing, Transportation, Woodworking
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Silicone Adhesive Sealant

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Silicone Sealant

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Momentive RTV

Basic Infomation
Place of Origin: USA
Brand Name: Momentive
Certification: TDS,SDS,Rohs
Model Number: Yg6111
Payment & Shipping Terms
Packaging Details: 1 piece
Delivery Time: 5-8days
Payment Terms: T/T,L/C,D/A,D/P,Western Union,MoneyGram
Supply Ability: 1000Piece
Product Description

Momentive YG6111 Semiconductor Thermal Joint Dielectric Compound

Basic Properties

Property Unit Value
Appearance
White
Specific Gravity (25°C)
2.45
Penetration (JIS K 2220) 310
Thermal Conductivity W/m·K 0.84
Dielectric Constant (60Hz)
5.0
Dissipation Factor (60Hz)
0.006
Volume Resistivity Ω·cm 2.0 × 10¹⁴
Evaporation (150°C 24 h) % 0.1
Bleed (150°C 24 h) % 0.4

Product Overview

SILCOOL YG6111 is a metal oxide-filled silicone oil compound designed to provide superior thermal conductivity. This combination of high purity fillers and silicones results in a smooth, homogeneous, thermally conductive dielectric compound with virtually no oil separation or high temperature weight loss, making it suitable for diverse industrial environments.

Specialized Properties

The special properties deepen the parameter significance: thermal conductivity (0.84 W/m·K) ensures efficient heat dissipation, reducing component temperatures; dielectric constant (5.0) and dissipation factor (0.006) provide excellent insulation; volume resistivity (2.0×10¹⁴ Ω·cm) guarantees high insulation; evaporation rate (only 0.1% at 150°C for 24 hours) and bleed rate (only 0.4% at 150°C for 24 hours) demonstrate high-temperature stability with little swelling effect on silicone elastomers, suitable for a wide operating temperature range from -50°C to 200°C.

Applications

YG6111 can be used in almost any industry, from electronics to automotive to aircraft to the semiconductor industries. Specific applications include semi-conductor devices and thermal joints where it maintains a positive seal to improve heat transfer; TV anode cap seal, power transistor, diodes, rectifiers, radiator fans, heat generating parts, and heat exchangers. These enable electrical and electronic components to function at lower temperatures, potentially increasing efficiency and prolonging life.

FAQ

1. Who are we?

We are Shenzhen Huazhisheng New Material Technology Co., Ltd., a professional industrial adhesives and sealants supplier based in China since 2018. we serve global markets: Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).

 

2. What products do you offer?

we supply high-performance adhesives and sealants from global leaders including:

Cemedine, Dow Corning, Shin-Etsu, Araldite, and Momentive,etc.

 

3. How do you guarantee product quality?

Quality assurance through:

Mandatory pre-production samples approval

Final inspection by QC team before shipment

International certifications: SGS, UL, FDA, RoHS, REACH

 

4. Why choose us over other suppliers?

Reliable Supply:Authentic products from top manufacturers

Expert Support:Technical guidance for product selection

Global Compliance:Certifications meeting target market standards

Efficient Service:Customized solutions & professional support

 

5. What services do you provide?

Delivery​:EXW/FOB/CIF

Payment​:USD/EUR/CNY/HKD via T/T, L/C

Support​:Technical consultation & logistics coordination

Momentive YG6111 Semiconductor Thermal Joint Dielectric Compound 0

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Contact Person : ouyang
Tel : +86 13510063180
Fax : 86-0769-82622296
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