ShinEtsu KE-1222 A/B Putty-Type Silicone Adhesive for Industrial Sealing & Molding
ShinEtsu KE-1222 A/B is a two-component, putty-like Room Temperature Vulcanizing (RTV) silicone rubber. It utilizes an addition-cure system, consisting of a blue Component A and a deep flesh tone Component B. Designed for industrial applications requiring high precision, strong adhesion, and fast curing, it typically comes in 1kg packaging.
| Item | Parameter |
|---|---|
| Product Name | ShinEtsu KE-1222 A/B |
| Composition | Silicone Rubber (Addition-Cure) |
| Appearance (A / B) | Blue / Deep Flesh Tone |
| Viscosity | Putty |
| Standard Curing Time | 23°C * 24 Hours |
| Packaging | 1kg |
| Dielectric Strength | > 20 kV/mm |
| Linear Shrinkage | < 0.2% |
| Adhesion Strength (Al) | > 1.2 MPa |
| Adhesion Strength (ABS) | > 1.0 MPa |
Shin-Etsu KE-1222 A/B is a high-performance industrial-grade adhesive sealant. Its unique dual-component design allows users to precisely control the curing process, ensuring uniform bonding to various substrates such as metals, plastics, ceramics, and glass. The mixed material has a putty-like texture, allowing for easy application and molding. It cures at room temperature within 24 hours to form a flexible and durable elastomer. Combining excellent physical-mechanical properties with chemical stability, it is an ideal choice for electronics encapsulation, industrial sealing, and mold making.
The core advantages of this product lie in its excellent weather resistance and electrical insulation properties. After accelerated aging tests at 150°C for 1000 hours, it retains more than 95% of its original tensile strength and exhibits high resistance to UV radiation and ozone, ensuring stability for long-term outdoor use. In terms of electrical properties, its dielectric strength exceeds 20 kV/mm, effectively preventing electrical leakage and short circuits in humid environments. Additionally, the cured material exhibits very low shrinkage (below 0.2%), ensuring dimensional accuracy in precision assemblies.
In addition to the automotive, woodworking, and electronics industries mentioned in the link, ShinEtsu KE-1222 A/B is widely used in mold making. It is often used for molding polyurethane resin, epoxy resin, polyester resin, wax, gypsum, and low-melting-point alloys. Thanks to its excellent flowability and dimensional stability, it can accurately reproduce complex details such as fingerprints and wood grains. Moreover, the curing process is non-exothermic, causing no thermal damage to the original model.
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