Video Channel of China Shenzhen Huazhisheng New Material Technology Co., Ltd.
Chat Now Contact Us
Home Videos Playlist Website

See Why Choose Rapid Fuse Cemedine Adhesive G-485 For Portable Battery Cases / Mobile Devices

Other Videos
December 18, 2025
Category Connection: Cemedine Adhesive
Chat Now Contact Us
Tags:
#Epoxy Resin Adhesive #Epoxy Adhesive #Epoxy Resin Cemedine Adhesive
Brief: Experience a brief tour of features designed to deliver dependable outcomes. In this video, you'll see how the Cemedine G-485 Rapid-Fuse Adhesive achieves molecular-level bonding for portable battery cases and mobile devices. Watch a demonstration of its ultra-rapid curing process and learn how it enhances production efficiency with vibration-resistant performance in extreme environments.
Related Product Features:
  • Engineered for rapid curing with 5-10 second surface dry time at 25℃ and a 30-second bonding window.
  • Provides exceptional heat resistance up to 100℃ and cold endurance down to -20℃ with zero delamination.
  • Achieves molecular-level bonding by dissolving material surfaces for polycarbonate and PC/ABS hybrid materials.
  • Offers 300% enhanced vibration resistance compared to conventional adhesives for durable assemblies.
  • Complies with EU environmental standards, being heavy metal and bromide free and RoHS compliant.
  • Enables 5-minute preliminary fixation and 15-minute full strength without requiring mechanical fixtures.
  • Ideal for TWS earphone charging case sealing and smartphone battery compartment bonding applications.
  • Suitable for portable medical device housing assembly and drone battery bay shock-resistant bonding.
FAQs:
  • What materials is the Cemedine G-485 adhesive designed for?
    Cemedine G-485 is specifically engineered for polycarbonate (PC) and PC/ABS hybrid materials, commonly used in portable battery cases and mobile devices.
  • How quickly does the G-485 adhesive cure?
    It features ultra-rapid processing with 5-10 seconds surface dry time at 25℃, enabling 5-minute preliminary fixation and 15-minute full strength without mechanical fixtures.
  • What temperature range can the G-485 adhesive withstand?
    The adhesive maintains performance in extreme environments, with tested resilience from -20℃ to 100℃, showing zero delamination after 24-hour exposure tests.
  • Is the Cemedine G-485 environmentally compliant?
    Yes, it is heavy metal and bromide free, fully compliant with EU RoHS directives, making it suitable for global electronics manufacturing standards.
Related Videos
View Shin-Etsu KM-9782 Emulsion Silicone Release Agent For Food Packaging Containers Demo 00:12

View Shin-Etsu KM-9782 Emulsion Silicone Release Agent For Food Packaging Containers Demo
Shinetsu Silicone
December 18, 2025
A Closer Look: Kf-968-100cs Modified ShinEtsu Silicone Oil Silicone Textile Auxiliaries 00:15

A Closer Look: Kf-968-100cs Modified ShinEtsu Silicone Oil Silicone Textile Auxiliaries
Shinetsu Silicone
December 18, 2025
View Huntsman Araldite 2011 Two Part Epoxy Adhesive Demo 00:09

View Huntsman Araldite 2011 Two Part Epoxy Adhesive Demo
Araldite Epoxy
December 08, 2025
View Silicone Solvent ShinEtsu KST-THINNER 14Kg For Electronics And Industrial Applications Demo 00:13

View Silicone Solvent ShinEtsu KST-THINNER 14Kg For Electronics And Industrial Applications Demo
Shinetsu Silicone
December 16, 2025
See Why Choose ShinEtsu G-40M High-Temperature Lubricating Grease 00:17

See Why Choose ShinEtsu G-40M High-Temperature Lubricating Grease
Shinetsu Silicone
December 11, 2025
ShinEtsu KE-1830 00:13

ShinEtsu KE-1830
Shinetsu Silicone
December 10, 2025
MOLYKOTE 165 LT High Load Grease with Extreme Pressure Performance 00:14

MOLYKOTE 165 LT High Load Grease with Extreme Pressure Performance
Molykote Grease
December 10, 2025
Watch: Araldite 2022-1 Methacrylate Adhesive For Challenging Substrates Fast Bonding Showcase 00:07

Watch: Araldite 2022-1 Methacrylate Adhesive For Challenging Substrates Fast Bonding Showcase
Araldite Epoxy
December 09, 2025
Introduce Dowsil SE 4450 Thermally Conductive Adhesive​ For Electronics Bonding For You 00:12

Introduce Dowsil SE 4450 Thermally Conductive Adhesive​ For Electronics Bonding For You
Dowsil Adhesive
December 08, 2025
Araldite® CW 1305 Epoxy Encapsulant 00:12

Araldite® CW 1305 Epoxy Encapsulant

Araldite Epoxy
December 08, 2025