Dowsil TC-4525 is a two-part, room temperature cure silicone gap filler with thermal conductivity of 2.5 W/m*K, low compression stress, and controlled silicone volatility.
This material cures to a soft and compressible elastomer designed to dissipate heat from components on printed circuit boards to heat sinks, providing a reliable cooling solution.
Dowsil TC-4525 offers:
| Property | Unit | Value |
|---|---|---|
| One or Two-part | - | Two |
| Mix Ratio | - | 1:1 |
| Color A/B | - | White/Blue |
| Viscosity, Mixed | Pa*s | 217 |
| Working Time at 25°C | minutes | 40 |
| Cure Time at 25°C | minutes | 120 |
| Thermal Conductivity | W/m*K | 2.5 |
| Hardness, Shore 00 | - | 40 |
| Hardness, Asker C | - | 32 |
| Volume Resistivity | Ω*cm | 2.6E14 |
| Dielectric Strength | kV/mm | 12 |
| Dielectric Constant at 1 MHz | - | 6.2 |
Dowsil TC-4525 is primarily used for thermal management in:
Ensuring long-term stability in high-temperature environments.
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