Brief: DOWSIL 3145 투명 접착 실런트, 전자 모듈 실링을 위한 MIL-A-46146 규격 준수 솔루션을 만나보세요. 이 1액형 상온 경화 실리콘은 높은 인장 강도, 뛰어난 전기적 특성, 금속, 세라믹, 유리에 대한 우수한 접착력을 제공합니다. 군사 및 고주파 전자 제품 응용 분야에 적합합니다.
Related Product Features:
Compliant with MIL-A-46146 Group II military standards for reliability in harsh environments.
High tensile strength (864 psi) and elongation (626%) for durable sealing.
Excellent electrical insulation with volume resistivity of 4.4×10¹⁴ ohm*cm.
Operational temperature range from -45°C to 200°C, suitable for extreme conditions.
Non-flow特性 (0.092-inch slump) and low viscosity (168 Pa-sec) for precise dispensing.
알루미늄에 336psi의 랩 셰어 강도와 함께 금속, 세라믹, 유리에 우수한 비공형 접착력.
Fast curing with tack-free in ~63.8 minutes at 25°C and >90% physical properties within 24-72 hours.
Ideal for electronic module sealing, PWB assembly, wire & lead sealing, and military equipment applications.
자주 묻는 질문:
What standards does the DOWSIL 3145 Clear Adhesive Sealant comply with?
The DOWSIL 3145 is compliant with MIL-A-46146 Group II TY I military standards, ensuring reliability in harsh environments.
What are the key electrical properties of DOWSIL 3145?
DOWSIL 3145 offers excellent electrical properties, including a dielectric strength of 485 V/mil and volume resistivity of 4.4×10¹⁴ ohm*cm, making it ideal for high-frequency electronics.
How long does it take for DOWSIL 3145 to cure?
DOWSIL 3145 achieves tack-free curing in approximately 63.8 minutes at 25°C and reaches >90% physical properties within 24-72 hours, depending on environmental conditions.