Sellador adhesivo transparente DOWSIL 3145 RTV MIL-A-46146 para sellado de módulos electrónicos

Adhesivo Dowsil
September 15, 2025
Category Connection: Adhesivo Dowsil
Brief: Descubra el sellador adhesivo transparente DOWSIL 3145, una solución conforme a MIL-A-46146 para el sellado de módulos electrónicos. Esta silicona monocomponente que cura a temperatura ambiente ofrece alta resistencia a la tracción, excelentes propiedades eléctricas y una adhesión superior a metales, cerámicas y vidrio. Perfecto para aplicaciones militares y de electrónica de alta frecuencia.
Related Product Features:
  • Compliant with MIL-A-46146 Group II military standards for reliability in harsh environments.
  • High tensile strength (864 psi) and elongation (626%) for durable sealing.
  • Excellent electrical insulation with volume resistivity of 4.4×10¹⁴ ohm*cm.
  • Operational temperature range from -45°C to 200°C, suitable for extreme conditions.
  • Non-flow特性 (0.092-inch slump) and low viscosity (168 Pa-sec) for precise dispensing.
  • Adhesión superior sin primado a metales, cerámica y vidrio con resistencia a la cizalladura de 336 psi en aluminio.
  • Fast curing with tack-free in ~63.8 minutes at 25°C and >90% physical properties within 24-72 hours.
  • Ideal for electronic module sealing, PWB assembly, wire & lead sealing, and military equipment applications.
Las preguntas:
  • What standards does the DOWSIL 3145 Clear Adhesive Sealant comply with?
    The DOWSIL 3145 is compliant with MIL-A-46146 Group II TY I military standards, ensuring reliability in harsh environments.
  • What are the key electrical properties of DOWSIL 3145?
    DOWSIL 3145 offers excellent electrical properties, including a dielectric strength of 485 V/mil and volume resistivity of 4.4×10¹⁴ ohm*cm, making it ideal for high-frequency electronics.
  • How long does it take for DOWSIL 3145 to cure?
    DOWSIL 3145 achieves tack-free curing in approximately 63.8 minutes at 25°C and reaches >90% physical properties within 24-72 hours, depending on environmental conditions.