Shin-Etsu X-23-7783D is a gray, high-viscosity thermal grease designed for cooling high-performance microprocessors, with thermal conductivity up to 6 W/mK (solvent-free) and 2% solvent content for screen-printing compatibility.
Developed by Shin-Etsu Chemical, X-23-7783D thermal grease enhances heat dissipation by eliminating air gaps (air conductivity: 0.027 W/mK) between processors and heat sinks. It is applied to the processor top, pressed evenly, and excess can be wiped with a soft cloth.
X-23-7783D is widely used in server CPUs, GPUs, and high-power LED cooling, particularly in automated screen-printing processes. Recommended by Intel/AMD for processors with TDP >100W
Property | Value |
---|---|
Appearance | Gray |
Viscosity (25°C) | 1500 Poise |
Thermal Conductivity | >4 W/mK (with solvent) |
>6 W/mK (w/o solvent, as X-23-7783) | |
Volatile Content | 2.5% (150°C×24hrs) |
1. Who are we?
We are Shenzhen Huazhisheng New Material Technology Co., Ltd., a professional industrial adhesives and sealants supplier based in China since 2018. we serve global markets: Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).
2. What products do you offer?
we supply high-performance adhesives and sealants from global leaders including:
Cemedine, Dow Corning, Shin-Etsu, Araldite, and Momentive,etc.
3. How do you guarantee product quality?
Quality assurance through:
Mandatory pre-production samples approval
Final inspection by QC team before shipment
International certifications: SGS, UL, FDA, RoHS, REACH
4. Why choose us over other suppliers?
Reliable Supply:Authentic products from top manufacturers
Expert Support:Technical guidance for product selection
Global Compliance:Certifications meeting target market standards
Efficient Service:Customized solutions & professional support
5. What services do you provide?
Delivery:EXW/FOB/CIF
Payment:USD/EUR/CNY/HKD via T/T, L/C
Support:Technical consultation & logistics coordination