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DOWSIL™ 1-4173 Thermally Conductive Adhesive with 1.8W/m·K Thermal Conductivity, UL 94-V0 Rating, and One-Part Curing for PCB Heat Sink Bonding

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DOWSIL™ 1-4173 Thermally Conductive Adhesive with 1.8W/m·K Thermal Conductivity, UL 94-V0 Rating, and One-Part Curing for PCB Heat Sink Bonding
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Features
Specifications
Brand: DOWSIL
Model: 1-4173
Specifications: 1.5kg
Category: Thermally Conductive Adhesive
Viscosity: 61Pa·s
Thermal Conductivity: 1.8W/m·K
UL Flammability: UL 94-V0
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1.8W/m·K Thermal Conductivity Thermally Conductive Adhesive

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UL 94-V0 Flammability Rating Silicone Adhesive

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One-Part Curing PCB Adhesive
Basic Infomation
Place of Origin: USA
Brand Name: DOWSIL
Certification: TDS,SDS,Rohs,COA
Model Number: 1-4173
Payment & Shipping Terms
Packaging Details: 1.5kg
Delivery Time: 3-5
Payment Terms: L/C,D/A,D/P,T/T,Western Union,MoneyGram
Supply Ability: 1000
Product Description
DOWSIL™ 1-4173 Thermally Conductive Adhesive for PCB Heat Sink Bonding
DOWSIL™ 1-4173 is a one-part gray, flowable thermally conductive adhesive that cures upon heating. It offers high tensile strength and good thermal conductivity (1.8 W/m*K), contains no solvents, requires no mixing, and is suitable for automated or manual dispensing.
Product Properties
Property Unit Value
One/Two-Part - One
Color - Gray
Viscosity Pa*s 61
Thermal Conductivity W/m*K 1.8
Cure Time at 150°C minutes 20
Lap Shear Strength (Al) MPa 4.5
CTE ppm/°C 125
UL Flammability - UL 94-V0
Technical Features
Formulated with polydimethylsiloxane and aluminum oxide, DOWSIL™ 1-4173 cures without by-products, enabling uniform curing in deep or confined sections. Its low surface tension ensures wetting on most substrates, reducing thermal contact resistance and efficiently transferring heat away from PCB components to improve reliability.
Special Properties
  • Unprimed adhesion to metals, ceramics, and epoxy laminates
  • Aluminum lap shear strength of 4.5 MPa
  • Linear CTE of 125 ppm/°C
  • Durometer hardness of Shore A 92
  • UL 94-V0 flammability rating
  • Resists ozone and UV degradation
  • Operating temperature range: -45°C to 200°C
Application Scenarios
DOWSIL™ 1-4173 is used for bonding integrated circuit substrates, sealing lids and housings, and attaching heat sinks in high-power LEDs, power modules, automotive electronics, and industrial control systems for thermal management.
About Our Company
Shenzhen Huazhisheng New Material Technology Co., Ltd.
A professional industrial adhesives and sealants supplier based in China since 2018. We serve global markets: Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).
Product Portfolio
We supply high-performance adhesives and sealants from global leaders including: Cemedine, Dow Corning, Shin-Etsu, Araldite, and Momentive.
Quality Assurance
  • Mandatory pre-production samples approval
  • Final inspection by QC team before shipment
  • International certifications: SGS, UL, FDA, RoHS, REACH
Why Choose Us
  • Reliable Supply: Authentic products from top manufacturers
  • Expert Support: Technical guidance for product selection
  • Global Compliance: Certifications meeting target market standards
  • Efficient Service: Customized solutions & professional support
Services Provided
Delivery: EXW/FOB/CIF; Payment: USD/EUR/CNY/HKD via T/T, L/C; Support: Technical consultation & logistics coordination
DOWSIL™ 1-4173 Thermally Conductive Adhesive with 1.8W/m·K Thermal Conductivity, UL 94-V0 Rating, and One-Part Curing for PCB Heat Sink Bonding 0
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Tel : +86 13510063180
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da.oyang@sanbang68.com
+86 13510063180
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