Shin-Etsu Launches High-Temperature Potting Encapsulant KE-1204BL A/B, Delivering Military-Grade Protection for Electron

September 1, 2025

Latest company news about Shin-Etsu Launches High-Temperature Potting Encapsulant KE-1204BL A/B, Delivering Military-Grade Protection for Electron
Corporate & Product Positioning

Shin-Etsu Chemical Co., Ltd., the global leader in silicone materials, has launched its next-generation dual-component heat-cure potting encapsulant KE-1204BL A/B. Certified to UL 94 V-0 – the highest flame-retardancy standard – this product is engineered to protect electronic components in extreme environments. It forms a durable, flexible rubber layer delivering exceptional high-temperature resistance (-40°C to +200°C), electrical isolation, and multi-substrate adhesion, making it ideal for high-reliability applications including new energy vehicles and aerospace systems.

Core Technology Breakdown

Leveraging advanced addition cure chemistry with a precision 1:1 mix ratio, KE-1204BL A/B offers breakthrough advantages:

  1. Military-Grade Protection: UL 94 V-0 certification guarantees flame extinction within 0 seconds after ignition removal with zero dripping
  2. Rapid Thermal Cure: Achieves full curing in just 15 minutes at 100°C, boosting efficiency by >50% vs conventional encapsulants
  3. Self-Adaptive Encapsulation: Self-leveling properties ensure complete coverage of complex geometries, while the 8-hour working time allows for precise processing
  4. Universal Adhesion: Bonds aggressively to diverse substrates including PCB, metals, plastics, glass, and ceramics, eliminating delamination risks
Electrical & Mechanical Performance

The material maintains stable dielectric properties under thermal stress:

  • Volume resistivity >1 TΩ·m (10x higher than GB/T 1408 requirements)
  • Dielectric constant 3.2 @50Hz (approaching air permittivity)
  • Dissipation factor as low as 0.001 @50Hz, minimizing high-frequency signal loss
    Mechanically, its Shore A hardness provides impact resistance while balanced tensile strength/elongation prevents thermal cycling failures
Application Scenarios

Proven deployments include:

  • Battery Management System (BMS) encapsulation in EVs
  • 5G base station power amplifier thermal management
  • IGBT module protection in industrial motor drives
  • Aerospace electronics vacuum environment sealing
Technical Compliance Statement

Shin-Etsu clarifies: Typical property values (e.g. density @23°C) are laboratory-measured. End-users must establish validation protocols per ISO 17025 standards. Global sample support is available, but final suitability requires client verification through certifications such as IEC 60529 IP rating tests.

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