September 1, 2025
Shin-Etsu Chemical Co., Ltd., the global leader in silicone materials, has launched its next-generation dual-component heat-cure potting encapsulant KE-1204BL A/B. Certified to UL 94 V-0 – the highest flame-retardancy standard – this product is engineered to protect electronic components in extreme environments. It forms a durable, flexible rubber layer delivering exceptional high-temperature resistance (-40°C to +200°C), electrical isolation, and multi-substrate adhesion, making it ideal for high-reliability applications including new energy vehicles and aerospace systems.
Leveraging advanced addition cure chemistry with a precision 1:1 mix ratio, KE-1204BL A/B offers breakthrough advantages:
The material maintains stable dielectric properties under thermal stress:
Proven deployments include:
Shin-Etsu clarifies: Typical property values (e.g. density @23°C) are laboratory-measured. End-users must establish validation protocols per ISO 17025 standards. Global sample support is available (http://www.shinetsusilicones.cn/sample-request), but final suitability requires client verification through certifications such as IEC 60529 IP rating tests.