Electronics Thermal Paste Electrolube HTCP 2.5 W/m.K For Thermal Management

Electrolube HTCP High-Power Electronics Thermal Paste

Product Properties

Product Introduction

Electrolube HTCP Heat Transfer Compound Plus is a highly thermally conductive, ​non-curing​ thermal interface paste formulated specifically for efficient heat dissipation in demanding electronic applications. Its key feature is its ​non-silicone synthetic oil base, making it the ideal choice where silicone contamination (due to silicone oil or low molecular weight siloxane migration) is a critical concern. HTCP is designed to fill microscopic air gaps between mating surfaces (like electronic components and heat sinks), significantly improving thermal transfer efficiency over air alone.

Enhanced Properties

Beyond its core thermal performance (2.5 W/m.K via guarded hot plate), HTCP's ​non-silicone nature​ is its defining characteristic, crucial for sensitive electronics in industries like aerospace, automotive sensing, or high-frequency RF where silicone outgassing can cause failures. Its ​non-curing formulation​ ensures it remains pliable indefinitely, facilitating easy component rework and maintenance without hardening or degradation issues. The ​low viscosity​ (101-112 Pa.s @ 1rpm) and specified ​penetration value (250)​​ ensure excellent flow and gap-filling characteristics for uniform, thin-layer application, which is vital for optimal heat transfer. Its ​electrical properties​ (high volume resistivity, dielectric strength, low permittivity) make it electrically safe for most power electronic applications. The UL94 V-0 equivalent rating confirms excellent flame retardancy.

Application Scenarios

​ Electrolube HTCP is specifically recommended for thermal management in electronic assemblies where silicones are prohibited or pose a contamination risk. Key application areas include:

• ​Power Electronics:​​ Diodes, transistors (BJTs, MOSFETs, IGBTs), thyristors (SCRs), power modules, rectifiers, voltage regulators. Its thermal performance helps manage heat in high-current switching devices.
• ​Sensitive Electronics:​​ Sensors (especially automotive, aerospace), RF components, optical devices, high-frequency circuits where silicone migration could impair performance or reliability.
• ​General Heat Dissipation:​​ Thermostats, power resistors, radiators, and any interface between a heat-generating component and a heat sink or chassis requiring efficient thermal coupling. Its ease of application and rework makes it suitable for both manufacturing and repair environments.
• ​Specific Examples (Based on TDS & Common Industry Use):​​ Mounting power semiconductors to heatsinks in electric vehicle (EV) power converters, cooling high-power LED drivers, thermal interface for radar modules, heat dissipation in server power supplies.

FAQ

1. Who are we?

We are Shenzhen Huazhisheng New Material Technology Co., Ltd., a professional industrial adhesives and sealants supplier based in China since 2018. we serve global markets: Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).

2. What products do you offer?

we supply high-performance adhesives and sealants from global leaders including:

Cemedine, Dow Corning, Shin-Etsu, Araldite, and Momentive,etc.

3. How do you guarantee product quality?

Quality assurance through:

Mandatory pre-production samples approval

Final inspection by QC team before shipment

International certifications: SGS, UL, FDA, RoHS, REACH

4. Why choose us over other suppliers?

Reliable Supply:Authentic products from top manufacturers

Expert Support:Technical guidance for product selection

Global Compliance:Certifications meeting target market standards

Efficient Service:Customized solutions & professional support

5. What services do you provide?

Delivery​:EXW/FOB/CIF

Payment​:USD/EUR/CNY/HKD via T/T, L/C

Support​:Technical consultation & logistics coordination