Shin Etsu X-23-7868-2d Cpu Mpu Thermal Paste X-23-7868-2d High Thermal Conductivity Silicone Grease

1
MOQ
CN¥3,057.42/pieces 1-49 pieces
Price
Shin Etsu X-23-7868-2d Cpu Mpu Thermal Paste X-23-7868-2d High Thermal Conductivity Silicone Grease
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Features
Specifications
CAS No.: ShinEtsu
Main Raw Material: THERMAL GREASE
Usage: Electronic Devices, Computers, Servers, Communication Equipment
Product Name: ShinEtsu X-23-7868-2D
Application: PC, NB, Server, LED, Automotive, Etc
Type: Thermal Interface Material
Package: 1kg/Piece
Chemical Resistance: Excellent
Adhesion: Strong
Color: Grey
Viscosity: Low
Elongation: High
Temperature Resistance: High
Form: Liquid
Curing Method: Room Temperature
Shelf Life: 12 Months
Hardness: Soft
Product Type: Silicone
Water Resistance: Excellent
Uv Resistance: Good
Highlight:

Shin Etsu Thermal Grease

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Silicone Synthetic Grease

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Shin Etsu Silicone

Basic Infomation
Place of Origin: Guangdong, China
Brand Name: ShinEtsu
Certification: TDS,SDS,Rohs
Model Number: ShinEtsu X-23-7868-2D
Payment & Shipping Terms
Packaging Details: 1 piece
Delivery Time: 5-8days
Payment Terms: T/T,L/C,D/A,D/P,Western Union,MoneyGram
Supply Ability: 1000Piece
Product Description

Product Introduction
hin-Etsu MicroSi’s X-23-7868-2D thermal interface material is an ideal choice for high-performance platforms. Its excellent thermal conductivity can significantly reduce the operating temperature of the device, thereby extending the device’s service life and improving its reliability. The material has a gray appearance, moderate viscosity, and is easy to apply and distribute evenly, forming an efficient thermal conduction channel between the chip and the heatsink. In addition, the volatile content of X-23-7868-2D is only 2.8% after 24 hours at 150℃, indicating its high chemical stability and ability to work stably in high-temperature environments for a long time.S

Product Special Attributes
The unique chemical formula and physical properties of X-23-7868-2D are its special attributes. It contains special chemical components that need to be volatilized by running the device in an open environment after the initial application to achieve the best thermal conductivity. This design not only ensures the material’s efficiency but also increases its flexibility in practical applications. In addition, the material has a specific gravity of 2.6, which means it can reduce the amount of material used while maintaining high performance, thereby reducing costs. Its packaging comes in various forms, including multiple specifications from 0.5 grams to 1.0 kilograms, which can meet the needs of different production scales.

Application scenarios
X-23-7868-2D is widely used in electronic devices that require efficient heat dissipation, such as high-performance computers, servers, communication equipment, and industrial control systems. In these devices, X-23-7868-2D can effectively reduce the thermal resistance between the chip and the heatsink, ensuring that the device maintains a stable temperature when operating at high loads. In addition, it can be used in devices that need to run stably for a long time, such as servers in data centers and communication base stations, which have extremely high requirements for the stability and reliability of heat dissipation materials. With its e
xcellent performance, X-23-7868-2D can meet these stringent application requirements.
Product Paramenters
Product name
Shin-Etsu X-23-7868-2D
CAS No.
Shin-Etsu
Main Raw Material
Thermal grease
Color
Grey
Package
1kg
Shin Etsu X-23-7868-2d Cpu Mpu Thermal Paste X-23-7868-2d High Thermal Conductivity Silicone Grease 0
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1.How can l get the price? -We usually quote within 24 hours after we get your inquiry(Except weekend and holidays)
-lf you are very urgent to get the price, please email us or contact us in other ways so that we can offer you a quote.
2. Can i buy samples placing orders?
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3.What is your lead time? -It depends on the order quantity and the season you place the order.
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Please confirm with us before placing orders.
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