Efficient Thermal Management for High-Performance Server MPUs with DOWSIL™ TC-5021

DOWSIL™ TC-5021 is a grey, flowable, non-curing thermally conductive compound. According to the technical profile and SDS, it features a high thermal conductivity of 3.3 W/m·K and a low thermal resistance (0.2 °C·cm²/W at 40 psi). Its self-leveling nature allows it to spread easily and achieve a thin Bond Line Thickness (BLT), effectively displacing air from rough surfaces. Being a non-curing paste, it requires no oven curing, which simplifies the assembly process and saves energy.

• High Filler Content:​ Heavily filled with organosilane modified Zinc Oxide (20%-40%), providing stable high thermal conductivity
• Electrical Insulation:​ High volume resistivity (3.7e+011 Ω·cm), ensuring safety by preventing short circuits between components
• Stability:​ Stable under normal conditions with a wide operating temperature range; however, as noted in the SDS, it should be kept away from moisture to avoid potential hydrogen gas generation

Engineers applied TC-5021 onto the MPU using automated dispensing equipment. The material’s viscosity (approx. 82,650 cP) allows for controlled flow without excessive bleed. During stress tests, the server CPUs maintained stable operating temperatures under full load, and the non-curing nature of the compound allowed for easy rework or replacement of the heat sink during maintenance cycles.