Efficient and Reliable Thermal Management Expert: DOWSIL™ CN-8760 Thermally Conductive Encapsulant​

DOWSIL™ CN-8760 is a two-part, 1:1 mix ratio thermally conductive silicone encapsulant from Dow. It combines excellent thermal conductivity, convenient processing, and reliable physical protection, specifically designed to safeguard sensitive electronic components and meet the stringent demands for heat dissipation and stability in modern high-power-density electronic devices.

• Excellent Thermal Conductivity: With moderate thermal conductivity, it effectively transfers heat generated by electronic components (such as power semiconductors, transformers, etc.) during operation, preventing device failure due to overheating and significantly improving product lifespan and reliability.
• Flexible Curing Options: It cures at room temperature and can be heat-accelerated, offering great flexibility for production processes. It is suitable for both small-scale repairs and automated mass production.
• Simple 1:1 Mix Ratio: The two-part, equal-volume mixing design greatly simplifies weighing and mixing processes, reducing the risk of curing failures due to ratio errors, making it ideal for manufacturing environments.
• Low Viscosity and Good Flowability: The mixed liquid has low viscosity and good flowability, allowing it to easily penetrate fine gaps on complex PCBs and components, achieving complete encapsulation without dead corners, and helping to minimize air entrapment.
• UL 94 V-0 Certification: The material is UL 94 V-0 certified, effectively inhibiting flame spread and providing a higher safety rating for end products.

The essence of silicone encapsulant curing is the formation of a stable three-dimensional network structure. As a two-part condensation cure silicone, the curing process of CN-8760 begins with the cross-linking reaction after mixing Parts A and B. Active groups on the molecular chains connect under the action of a catalyst, forming robust Si-O-Si bonds, gradually transforming the liquid into a flexible solid elastomer. This curing process produces almost no exotherm, and the curing rate is not limited by the potting thickness, avoiding potential damage to delicate components caused by internal heat buildup.

• Power Modules: Provides insulation and thermal protection for IGBT modules in electric vehicles and industrial inverters.
• Adapters and Chargers: Protects internal magnetic components and circuits, increasing power density and safety.
• Inverters and Transformers: Used in solar inverters, UPS systems, etc., ensuring the stable operation of power conversion equipment in high-temperature environments.
• Sensors and Control Units: Encapsulates precision sensors and electronic control units to resist the effects of harsh environments such as moisture, dust, and vibration.

• Surface Preparation: For optimal adhesion, it is recommended to clean the surfaces to be bonded. For certain difficult-to-bond substrates, a specific primer may be required.
• Pot Life: The mixed material has a specific usable time (pot life), which is significantly affected by ambient temperature. It is recommended to complete the potting operation within the specified conditions.
• Storage Requirements: The product should be stored sealed in a dry environment, avoiding moisture contact. Partially filled containers should be purged with dry air or nitrogen to extend shelf life.

With its reliable performance, convenient processing, and broad application adaptability, DOWSIL™ CN-8760 Thermally Conductive Encapsulant is a powerful tool for electronics engineers to solve thermal management and protection challenges. Choosing CN-8760 means opting for long-lasting and stable operational assurance for your electronic devices.