ShinEtsu X-23-8117 High Conductivity Thermal Interface Material with 6.2 W/m*K for Semiconductor Grade Screen Printing Grease

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ShinEtsu X-23-8117 High Conductivity Thermal Interface Material with 6.2 W/m*K for Semiconductor Grade Screen Printing Grease
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Features
Specifications
Highlight:

High Conductivity Thermal Interface Material

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6.2 W/m*K Screen Printing Grease

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Semiconductor Grade Thermal Grease

Basic Infomation
Place of Origin: Japan
Brand Name: ShinEtsu
Certification: TDS,SDS,Rohs,COA
Model Number: X-23-8117
Payment & Shipping Terms
Packaging Details: 1kg
Delivery Time: 3-5
Supply Ability: 1000
Product Description
ShinEtsu X-23-8117 Thermal Interface Material
High conductivity screen printing grease specifically engineered for semiconductor thermal management applications.
Product Overview
Optimized for screen printing, stencil printing, and dispensing processes, this advanced thermal interface material features low application viscosity and exceptional thermal conductivity to meet the demanding thermal management requirements of high-performance semiconductors.
ShinEtsu X-23-8117 High Conductivity Thermal Interface Material with 6.2 W/m*K for Semiconductor Grade Screen Printing Grease 0
Technical Specifications
Property Value
Color Gray
Viscosity (pre-flash) 80 Pa*s
Viscosity (post-flash) 700 Pa*s
Thermal Conductivity 6.2 W/m*K
Thermal Resistance 6.1 mm²*K/W
Bond Line Thickness (BLT) 26 μm
Key Characteristics
  • Significant viscosity increase post-flash (700 Pa*s) ensures excellent shape stability after application
  • Adapts effectively to variable bond line thicknesses
  • Stable homogeneous mixture with high pump-out resistance in vertical applications
  • Compliant with RoHS and REACH environmental standards
  • Available in multiple packaging options: syringes (0.5-3g), cartridges (55g), and bulk (1kg)
  • Recommended storage conditions: 0°C to 30°C
Application Scenarios
Ideal for thermal interfaces in high-performance computing components including CPUs, GPUs, and AI chips. Widely used in data center servers, 5G base stations, and automotive electronics for reliable high-temperature, high-power thermal management.
About Huazhisheng New Material Technology
Shenzhen Huazhisheng New Material Technology Co., Ltd. is a professional supplier of industrial adhesives and sealants serving global markets since 2018.
Market Distribution
Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).
Product Portfolio
We supply high-performance adhesives and sealants from global industry leaders including Cemedine, Dow Corning, Shin-Etsu, Araldite, Momentive, and other premium manufacturers.
Quality Assurance
  • Comprehensive quality control with mandatory pre-production sample approval
  • Final inspection before shipment
  • International certifications: SGS, UL, FDA, RoHS, REACH
Competitive Advantages
Reliable Supply
Authentic products sourced directly from top manufacturers
Expert Support
Technical guidance for optimal product selection and application
Global Compliance
Certifications meeting international market standards
Efficient Service
Customized solutions and professional support
Service Offerings
Delivery: EXW/FOB/CIF
Payment: USD/EUR/CNY/HKD via T/T, L/C
Support: Technical consultation & logistics coordination
ShinEtsu X-23-8117 High Conductivity Thermal Interface Material with 6.2 W/m*K for Semiconductor Grade Screen Printing Grease 1
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Contact Person : ouyang
Tel : +86 13510063180
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