Shin-Etsu X-23-8079-2 High Thermal Conductivity Grease for High-Performance Semiconductor Devices

Shin-Etsu MicroSi's X-23-8079-2 is a Non-Solvent thermal interface material (thermal grease) developed to meet the thermal management requirements of high-performance semiconductor devices. This product features excellent thermal performance, helping electronic devices to remain cooler and increasing their long-term reliability.

X-23-8079-2 is a stable homogeneous mixture that ensures consistent thermal performance. It can be easily applied via dispensing, stencil printing, or screen printing methods. The product is RoHS and REACH compliant and has a shelf life of two years from the date of manufacturing if stored properly in the unopened original package.

The product is available in several cost-effective packages, including syringes, cartridges, and bulk cans, to suit various production and field requirements. Syringes offer the most flexibility for both production and field applications. Cartridges can be utilized with manual, automated, or silk-screening equipment. The delivery system allows for dispensing while protecting the integrity and exposure level of the unused portion.

Typical applications for X-23-8079-2 include various semiconductor devices that require an efficient thermal solution, such as power transistors, ICs, CPUs, and stacked memory modules.