Three Bond 2212 is a one-component epoxy resin designed for bonding, fixing, and sealing electrical and electronic components. As electrical and mechanical components become increasingly miniaturized and lightweight while achieving higher performance, the requirements for encapsulating materials in terms of chemical, thermal, and physical properties continue to rise. At the same time, there is growing demand for excellent handling properties to support automation in assembly technology and accelerate manufacturing processes. Three Bond 2212 was developed to meet these requirements.
One-component and solvent-free; no weighing, mixing, or stirring required, making it extremely suitable for automatic dispensing systems.
Fast curing enables considerable energy savings and supports assembly automation, allowing on-line integration into manufacturing processes without manual work.
Contains over 99% non-volatile substances, resulting in almost no outgassing and shrinkage during curing.
The cured resin offers excellent electrical properties, high strength, and outstanding chemical resistance.
Ideal for fixing and sealing electrical and electronic components such as relays, sensors, coils, microchips, switches, and terminal blocks.
| Item | Result | Unit |
|---|---|---|
| Color | Black | — |
| Viscosity at 25°C | 25 | Pa·s |
| Density at 25°C | 1.39 | g/cm³ |
| Curing time at 80°C | 30 | min |
| Curing time at 100°C | 20 | min |
| Curing time at 120°C | 10 | min |
| Curing time at 150°C | 1 | min |
| Shore hardness | 93 | D |
| Shear strength Fe/Fe at 25°C | 8.8 | MPa |
| Shear strength Fe/Fe at 100°C | 8.8 | MPa |
| Shear strength Fe/Fe at 120°C | 8.8 | MPa |
| Shear strength Fe/Fe at 150°C | 8.3 | MPa |
| Shear strength Fe/Fe at 200°C | 2.0 | MPa |
| Glass transition temperature | 130 | °C |
| Coefficient of thermal expansion | 45 * 10⁻⁶ | °C⁻¹ |
| Water absorption (100°C * 1 h) | +0.40 | % |
| Pressure cooker (121°C * 72 h) | +2.0 | % |
| Volume resistivity | 1.6 * 10¹⁴ | Ω·m |
| Dielectric constant at 1 MHz | 3.4 | — |
| Loss factor at 1 MHz | 0.020 | — |
| Dielectric breakdown strength | 23 | MV/m |
| Arc resistance | 140 | s |
Relays
Sensors
Coils
Microchips
Switches
Terminal blocks
Other electrical/electronic components requiring bonding, fixing, sealing, or encapsulation
Keep the epoxy resin in its original container tightly closed and store it in a dark, dry, well-ventilated, and cool place.
Allow the product to reach room temperature before opening the container; otherwise, condensation may form.
For optimal results, remove moisture, grease, and other contaminants from the bonding surfaces.
Apply an appropriate amount of epoxy resin evenly to one of the bonding surfaces according to the joint conditions (width, roughness, unevenness, etc.), then immediately join the parts, position them correctly, and fix them.
The degree of curing varies depending on layer thickness, ambient temperature, and process duration.
When using precision resins, changes in viscosity as a function of ambient temperature can be checked.
Once dispensed, the product should not be poured back into the original container. Excess material can be easily removed with a cloth.
Q1: Is Three Bond 2212 a one-component or two-component product?
A1: It is a one-component epoxy resin. No weighing, mixing, or stirring is required.
Q2: Is it suitable for automatic dispensing?
A2: Yes. Because it is one-component and solvent-free, it is extremely suitable for automatic dispensing systems.
Q3: Does it produce outgassing or shrinkage during curing?
A3: The resin contains over 99% non-volatile substances, so there is almost no outgassing or shrinkage during curing.
Q4: What are the typical curing conditions?
A4: 30 min at 80°C, 20 min at 100°C, 10 min at 120°C, or 1 min at 150°C.
Q5: What are the main applications?
A5: Fixing and sealing electrical and electronic components such as relays, sensors, coils, microchips, switches, and terminal blocks.
Q6: How should it be stored?
A6: Keep the original container tightly closed and store in a dark, dry, well-ventilated, and cool place. Shelf life at 5°C is 7 months.
Q7: What should be noted before use?
A7: Allow the product to reach room temperature before opening the container; remove moisture, grease, and contaminants from bonding surfaces; do not pour dispensed product back into the original container.
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