Three Bond 2212B One-Component Epoxy Resin Adhesive for Electronic Component Fixing and Sealing

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MOQ
158.37
Price
Three Bond 2212B One-Component Epoxy Resin Adhesive for Electronic Component Fixing and Sealing
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Features
Specifications
Farbe: Schwarz
Viskosität Bei 25°C: 25Pa·s
Dichte Bei 25°C: 1.39g/cm³
Shore-Härte: 93 D
Basic Infomation
Place of Origin: JAPAN
Brand Name: Three Bond
Certification: TDS,SDS,COA,Rohs
Model Number: 2212
Payment & Shipping Terms
Packaging Details: 100g
Delivery Time: 3-5
Payment Terms: L/C,D/A,D/P,T/T
Supply Ability: 1000
Product Description

1, Product Overview

Three Bond 2212 is a one-component epoxy resin designed for bonding, fixing, and sealing electrical and electronic components. As electrical and mechanical components become increasingly miniaturized and lightweight while achieving higher performance, the requirements for encapsulating materials in terms of chemical, thermal, and physical properties continue to rise. At the same time, there is growing demand for excellent handling properties to support automation in assembly technology and accelerate manufacturing processes. Three Bond 2212 was developed to meet these requirements.


2,Key Benefits

  • One-component and solvent-free; no weighing, mixing, or stirring required, making it extremely suitable for automatic dispensing systems.

  • Fast curing enables considerable energy savings and supports assembly automation, allowing on-line integration into manufacturing processes without manual work.

  • Contains over 99% non-volatile substances, resulting in almost no outgassing and shrinkage during curing.

  • The cured resin offers excellent electrical properties, high strength, and outstanding chemical resistance.

  • Ideal for fixing and sealing electrical and electronic components such as relays, sensors, coils, microchips, switches, and terminal blocks.


3, Typical Properties

ItemResultUnit
Color Black
Viscosity at 25°C25Pa·s
 Density at 25°C1.39g/cm³
Curing time at 80°C30min
 Curing time at 100°C20min
 Curing time at 120°C10min
 Curing time at 150°C1min
Shore hardness93D
Shear strength Fe/Fe at 25°C8.8MPa
Shear strength Fe/Fe at 100°C8.8MPa
Shear strength Fe/Fe at 120°C8.8MPa
Shear strength Fe/Fe at 150°C8.3MPa
Shear strength Fe/Fe at 200°C2.0MPa
Glass transition temperature130°C
Coefficient of thermal expansion45 * 10⁻⁶°C⁻¹
Water absorption (100°C * 1 h)+0.40%
Pressure cooker (121°C * 72 h)+2.0%
Volume resistivity1.6 * 10¹⁴Ω·m
Dielectric constant at 1 MHz3.4
Loss factor at 1 MHz0.020
Dielectric breakdown strength23MV/m
Arc resistance140s

4,Applications
Three Bond 2212 is suitable for fixing and sealing electrical and electronic components. Typical applications include:

  • Relays

  • Sensors

  • Coils

  • Microchips

  • Switches

  • Terminal blocks

  • Other electrical/electronic components requiring bonding, fixing, sealing, or encapsulation


5, Instructions for Use

  • Keep the epoxy resin in its original container tightly closed and store it in a dark, dry, well-ventilated, and cool place.

  • Allow the product to reach room temperature before opening the container; otherwise, condensation may form.

  • For optimal results, remove moisture, grease, and other contaminants from the bonding surfaces.

  • Apply an appropriate amount of epoxy resin evenly to one of the bonding surfaces according to the joint conditions (width, roughness, unevenness, etc.), then immediately join the parts, position them correctly, and fix them.

  • The degree of curing varies depending on layer thickness, ambient temperature, and process duration.

  • When using precision resins, changes in viscosity as a function of ambient temperature can be checked.

  • Once dispensed, the product should not be poured back into the original container. Excess material can be easily removed with a cloth.


6,Frequently Asked Questions

Q1: Is Three Bond 2212 a one-component or two-component product?
A1: It is a one-component epoxy resin. No weighing, mixing, or stirring is required.

Q2: Is it suitable for automatic dispensing?
A2: Yes. Because it is one-component and solvent-free, it is extremely suitable for automatic dispensing systems.

Q3: Does it produce outgassing or shrinkage during curing?
A3: The resin contains over 99% non-volatile substances, so there is almost no outgassing or shrinkage during curing.

Q4: What are the typical curing conditions?
A4: 30 min at 80°C, 20 min at 100°C, 10 min at 120°C, or 1 min at 150°C.

Q5: What are the main applications?
A5: Fixing and sealing electrical and electronic components such as relays, sensors, coils, microchips, switches, and terminal blocks.

Q6: How should it be stored?
A6: Keep the original container tightly closed and store in a dark, dry, well-ventilated, and cool place. Shelf life at 5°C is 7 months.

Q7: What should be noted before use?
A7: Allow the product to reach room temperature before opening the container; remove moisture, grease, and contaminants from bonding surfaces; do not pour dispensed product back into the original container.

Ratings & Review

Overall Rating

5.0
Based on 50 reviews for this supplier

Rating Snapshot

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All Reviews

A
A*r
Pakistan Jul 11.2026
Ok
P
P*a
Sri Lanka Feb 17.2026
great
M
M*j
Paraguay Jul 25.2025
llego bien es el producto
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