DOWSIL™ TC-5288 Blue Thermal Compound: Delivering Superior Thermal Management for High-Performance Computing Devices

As processors in servers, desktops, notebooks, and game consoles continue to advance, efficient heat dissipation has become critical for ensuring stable operation and extending device lifespan. The DOWSIL™ brand from Dow introduces the TC-5288 Blue Thermal Compound, an advanced material solution designed to meet this challenge. With its high thermal conductivity, low thermal resistance, and easy application, it aims to provide reliable thermal protection for electronics designers and manufacturers.

DOWSIL™ TC-5288 is a solventless, one-part, non-curing paste-like thermal interface material (TIM). Its core advantage lies in its ability to form an extremely thin and uniform bond line between a heat sink and a heat source (such as a CPU or GPU), effectively filling microscopic air gaps to minimize interfacial thermal resistance.

• High Thermal Conductivity: With a thermal conductivity of 2.9 W/m•K, it efficiently transfers heat away from critical chips to the heat sink.
• Extremely Low Thermal Resistance: At 40 psi, its thermal resistance is as low as 0.03 °C-cm²/W, ensuring highly efficient heat transfer.
• Ultra-Thin Bond Line: Under 40 psi pressure, it achieves a bond line thickness of just 0.3 mils (0.007 mm), creating ideal conditions for optimal thermal performance.
• Blue for Inspection: The distinctive blue color facilitates easy visual inspection during the application process, ensuring complete coverage and consistency while reducing application errors.
• Long-Term Stability: As a non-curing material, it maintains stable viscosity characteristics under long-term use and temperature cycling, preventing pump-out or drying out, thereby ensuring long-term thermal performance.

DOWSIL™ TC-5288 is specifically optimized for cooling processors in various high-performance computing devices. Its application scenarios include:

• Data Center Servers: Provides consistent and stable cooling for CPUs in cloud and enterprise servers, ensuring high availability of data centers.
• High-Performance Desktops and Workstations: Meets the cooling demands of gamers, graphic designers, and engineers for extreme CPU/GPU overclocking and prolonged high-load operation.
• Slim Notebooks: Compensates for the limitations of compact cooling modules in space-constrained designs through highly efficient thermal materials.
• Gaming Consoles: Delivers reliable thermal management for the powerful processors that drive immersive gaming experiences.

With a viscosity of 110,000 cP, TC-5288 offers moderate flowability, making it suitable for both automated and manual dispensing while preventing excessive run-off on vertical surfaces. Its 99.95% non-volatile content ensures minimal weight loss and stable performance during application.