ShinEtsu CLG-3500 Gap Filler with 3.5 W/m·K Thermal Conductivity for Electronics Thermal Management -40 to +180°C Use Temperature Range and 8.9 kV/mm Dielectric Strength

1
MOQ
2260
कीमत
ShinEtsu CLG-3500 Gap Filler with 3.5 W/m·K Thermal Conductivity for Electronics Thermal Management -40 to +180°C Use Temperature Range and 8.9 kV/mm Dielectric Strength
विशेषताएं गेलरी उत्पाद विवरण अब बात करें
विशेषताएं
निर्दिष्टीकरण
कम गंध: हाँ
इलाज काल: 24 घंटे
इलाज का समय: कमरे के तापमान पर 24 घंटे
सब्सट्रेट: धातु, प्लास्टिक, रबर, कांच, सिरेमिक
इलाज का समय: 24 घंटे
तापमान प्रतिरोध: -60 डिग्री सेल्सियस से 250 डिग्री सेल्सियस
ब्रांड: शिनेट्सु
प्रमुखता देना:

3.5 W/m·K Thermal Interface Material

,

-40 to +180°C Gap Filler

,

8.9 kV/mm Silicone Adhesive

मूलभूत जानकारी
उत्पत्ति के प्लेस: जापान
ब्रांड नाम: ShinEtsu
प्रमाणन: SDS,TDS,Rohs
मॉडल संख्या: सीएलजी-3500
भुगतान & नौवहन नियमों
पैकेजिंग विवरण: 2 किलो
प्रसव के समय: 3-5
भुगतान शर्तें: एल/सी, डी/ए, डी/पी, टी/टी, वेस्टर्न यूनियन, मनीग्राम
आपूर्ति की क्षमता: 1000
उत्पाद विवरण
ShinEtsu CLG-3500 Gap Filler, High Thermal Conductivity Interface Material for Electronics Thermal Management
Product Description
ShinEtsu CLG-3500 is a pre-cured, white silicone-based gap filler designed as a thermal interface material (TIM) to fill air gaps between heat-generating components and heat sinks, significantly improving heat dissipation efficiency in electronic devices.
Key Features
  • Excellent pump-out resistance for long-term reliability
  • Maintains stable thermal performance under severe thermal cycling
  • Suitable for thick applications on uneven surfaces or larger gaps
  • Balanced thermal conductivity and viscosity for easy application
  • Low molecular weight siloxane content (≤300 ppm) minimizes contamination
Technical Specifications
Parameter Value Unit Notes
Appearance White - -
Specific Gravity at 25°C 3.1 - -
Viscosity at 25°C 250 Pa·s -
Thermal Conductivity 3.5 W/m·K Key Feature
Dielectric Breakdown Strength 8.9 kV/mm -
Use Temperature Range -40 to +180 °C -
LMW Siloxane Content ≤300 ppm ∑D3~D10
Applications
ShinEtsu CLG-3500 is widely used in electronics requiring efficient heat dissipation across gaps, including:
  • Power supplies and automotive electronics (LED headlights, ECUs)
  • Battery management systems
  • Telecommunications infrastructure (base stations)
  • Servers and networking equipment
  • Applications with uneven surfaces or components subject to vibration
ShinEtsu CLG-3500 Gap Filler with 3.5 W/m·K Thermal Conductivity for Electronics Thermal Management -40 to +180°C Use Temperature Range and 8.9 kV/mm Dielectric Strength 0
About Our Company
Shenzhen Huazhisheng New Material Technology Co., Ltd. is a professional supplier of industrial adhesives and sealants, serving global markets since 2018. Our distribution network covers Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).
Our Product Offerings
  • Cemedine
  • Dow Corning
  • Shin-Etsu
  • Araldite
  • Momentive
अनुशंसित उत्पाद
हम से संपर्क में रहें
व्यक्ति से संपर्क करें : ouyang
दूरभाष : +86 13510063180
शेष वर्ण(20/3000)