Startseite /Produkte/Silikonklebstoff/ShinEtsu CLG-3500 Gap Filler with 3.5 W/m·K Thermal Conductivity for Electronics Thermal Management -40 to +180°C Use Temperature Range and 8.9 kV/mm Dielectric Strength

ShinEtsu CLG-3500 Gap Filler with 3.5 W/m·K Thermal Conductivity for Electronics Thermal Management -40 to +180°C Use Temperature Range and 8.9 kV/mm Dielectric Strength

1
MOQ
2260
Preis
ShinEtsu CLG-3500 Gap Filler with 3.5 W/m·K Thermal Conductivity for Electronics Thermal Management -40 to +180°C Use Temperature Range and 8.9 kV/mm Dielectric Strength
Eigenschaften Galerie Produkt-Beschreibung Wir Reden Jetzt.
Eigenschaften
Technische Daten
Niedriger Geruch: Ja
Härtungszeit: 24 Stunden
Aushärtezeit: 24 Stunden bei Raumtemperatur
Substrat: Metall
Heilzeit: 24 Stunden
TemperaturWiderstand: -60°C zu 250°C
Marke: Shin-Etsu
Hervorheben:

3.5 W/m·K Thermal Interface Material

,

-40 to +180°C Gap Filler

,

8.9 kV/mm Silicone Adhesive
Grundinformation
Herkunftsort: JAPAN
Markenname: ShinEtsu
Zertifizierung: SDS,TDS,Rohs
Modellnummer: CLG-3500
Zahlung und Versand AGB
Verpackung Informationen: 2 kg
Lieferzeit: 3-5
Zahlungsbedingungen: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Versorgungsmaterial-Fähigkeit: 1000
Produkt-Beschreibung
ShinEtsu CLG-3500 Gap Filler, High Thermal Conductivity Interface Material for Electronics Thermal Management
Product Description
ShinEtsu CLG-3500 is a pre-cured, white silicone-based gap filler designed as a thermal interface material (TIM) to fill air gaps between heat-generating components and heat sinks, significantly improving heat dissipation efficiency in electronic devices.
Key Features
  • Excellent pump-out resistance for long-term reliability
  • Maintains stable thermal performance under severe thermal cycling
  • Suitable for thick applications on uneven surfaces or larger gaps
  • Balanced thermal conductivity and viscosity for easy application
  • Low molecular weight siloxane content (≤300 ppm) minimizes contamination
Technical Specifications
Parameter Value Unit Notes
Appearance White - -
Specific Gravity at 25°C 3.1 - -
Viscosity at 25°C 250 Pa·s -
Thermal Conductivity 3.5 W/m·K Key Feature
Dielectric Breakdown Strength 8.9 kV/mm -
Use Temperature Range -40 to +180 °C -
LMW Siloxane Content ≤300 ppm ∑D3~D10
Applications
ShinEtsu CLG-3500 is widely used in electronics requiring efficient heat dissipation across gaps, including:
  • Power supplies and automotive electronics (LED headlights, ECUs)
  • Battery management systems
  • Telecommunications infrastructure (base stations)
  • Servers and networking equipment
  • Applications with uneven surfaces or components subject to vibration
ShinEtsu CLG-3500 Gap Filler with 3.5 W/m·K Thermal Conductivity for Electronics Thermal Management -40 to +180°C Use Temperature Range and 8.9 kV/mm Dielectric Strength 0
About Our Company
Shenzhen Huazhisheng New Material Technology Co., Ltd. is a professional supplier of industrial adhesives and sealants, serving global markets since 2018. Our distribution network covers Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).
Our Product Offerings
  • Cemedine
  • Dow Corning
  • Shin-Etsu
  • Araldite
  • Momentive
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