December 30, 2025
DOWSIL™ SE 4485 Thermally Conductive Adhesive Enables Reliable Thermal Management for High-Density Electronics
As consumer electronics, communication devices, and power modules evolve toward thinner designs and higher performance, efficient heat dissipation becomes critical for device stability and longevity. DOWSIL™ SE 4485, a one-component moisture-cure thermal adhesive, provides an effective thermal interface material (TIM) solution with its high thermal conductivity, fast skin-over time, and strong adhesion, while meeting UL 94 V-0 flame retardancy standards.
Key Advantages
High Thermal Conductivity: 2.8 W/mK enables efficient heat transfer from chips to heat sinks, reducing operating temperatures.
Rapid Curing: 10-minute skin-over time at 25°C accelerates production cycles.
Semi-Flowable Texture: Facilitates gap filling between uneven surfaces, minimizing thermal resistance.
Primer-Free Adhesion: Bonds directly to glass, metals, and ceramics without surface pretreatment.
High Reliability: Stable performance from -45°C to 200°C, suitable for harsh conditions.
Application Examples
Case 1: LED Lighting Thermal Management
In compact LED modules, SE 4485 replaces mechanical fasteners+thermal grease by bonding aluminum substrates to heat sinks. Its elastomeric properties after curing absorb thermal stress, reducing light decay by 20% under high temperatures.
Case 2: 5G Communication Module Encapsulation
For a 5G base station power amplifier dissipating 15W in a confined space, SE 4485 is dispensed automatically between chips and housing. Its 2.8 W/mK conductivity (86% higher than standard epoxy) ensures stable operation under full load.
Case 3: Industrial Power Adapter Potting
For power adapters with ≤6mm potting depth, SE 4485 cures fully within 7 days, providing flame-retardant (UL 94 V-0) and insulating (19 kV/mm dielectric strength) protection while keeping core temperatures below 85°C.
Process Compatibility
Dispensing: Compatible with manual or automated dispensing; 54mm flowability suits narrow gaps.
Curing: Moisture-cure at room temperature eliminates heating equipment, reducing energy costs.
Safety & Compliance: Solvent-free, RoHS and UL certified for electronics industry standards.
Conclusion
DOWSIL™ SE 4485 combines thermal performance with process flexibility, making it an ideal choice for thermal management in high-power-density electronics. From consumer devices to industrial equipment, it empowers engineers to balance cooling efficiency and reliability in compact designs, pushing the boundaries of innovation.
