Dowsil EA-4100 Needle-Dispensed Adhesive with Moisture Cure and 250% Elongation for Electronics Encapsulation

1
MOQ
CN¥52.33
Price
Dowsil EA-4100 Needle-Dispensed Adhesive with Moisture Cure and 250% Elongation for Electronics Encapsulation
Features Gallery Product Description Chat Now
Features
Specifications
CAS No.: DOWSIL
Other Names: DOWSIL EA-4100
Main Raw Material: Sealant
Water Resistance: Excellent
Flexibility: High
Uv Resistance: Excellent
Adhesion Strength: Strong
Chemical Resistance: Excellent
Type: Adhesive
Highlight:

Needle Dispensed Dowsil Adhesive

,

EA-4100 Dowsil Adhesive

,

Electronics Encapsulation Dowsil Adhesive

Basic Infomation
Place of Origin: Guangdong, China
Brand Name: DOWSIL
Certification: TDS,SDS,Rohs
Model Number: EA-4100
Payment & Shipping Terms
Packaging Details: 1 piece
Delivery Time: 5-8days
Payment Terms: T/T,L/C,D/A,D/P,Western Union,MoneyGram
Supply Ability: 1000Piece
Product Description
Dowsil EA-4100 Needle-Dispensed Adhesive for Electronics Encapsulation
Basic Properties
Dowsil EA-4100 is a one-part, moisture-cure white paste adhesive with density 1.42 g/cm³ (cured), Shore A hardness 45, and elongation at break 250%. Designed for needle dispensing in electronics encapsulation, operable from -45°C to 200°C.
Product Description
EA-4100 cures via ambient moisture-triggered condensation, eliminating heating systems (tack-free in 9 min@25°C). 260 g/min extrusion rate suits automated dispensing, while 1 cm slump enables uniform filling. Volume resistivity and dielectric strength data not provided in TDS.
Technical Characteristics
Property Value Test Condition
Cure Mechanism Moisture Cure Ambient RH 30-80%
Color White Paste Visual
Extrusion Rate 260 g/min --
Slump Flow 1 cm --
Tack-Free Time 9 min 25°C
Tensile Strength 2.3 MPa --
Elongation at Break 250% --
Shore A Hardness 45 Cured
Application Scenarios
  • Power Module Potting: Encapsulates IGBT modules. 250% elongation absorbs thermal cycling stress, compliant with MIL-STD-810G thermal shock.
  • Automotive Sensor Bonding: Adheres O₂ sensor connectors. -45°C flexibility prevents cracking, implemented in assembly lines.
  • LED Driver Sealing: Edge-seals outdoor PCBs. Moisture-cure properties suit high-humidity environments, achieving IP67 rating.
  • Chip Reinforcement: Secures processor peripherals. 45 Shore A hardness balances impact resistance & stress relief, used in Huawei base stations.
Frequently Asked Questions
Who are we?
We are Shenzhen Huazhisheng New Material Technology Co., Ltd., a professional industrial adhesives and sealants supplier based in China since 2018. We serve global markets: Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).
What products do you offer?
We supply high-performance adhesives and sealants from global leaders including: Cemedine, Dow Corning, Shin-Etsu, Araldite, and Momentive, etc.
How do you guarantee product quality?
Quality assurance through: Mandatory pre-production samples approval, Final inspection by QC team before shipment, International certifications: SGS, UL, FDA, RoHS, REACH
Why choose us over other suppliers?
  • Reliable Supply: Authentic products from top manufacturers
  • Expert Support: Technical guidance for product selection
  • Global Compliance: Certifications meeting target market standards
  • Efficient Service: Customized solutions & professional support
What services do you provide?
  • Delivery: EXW/FOB/CIF
  • Payment: USD/EUR/CNY/HKD via T/T, L/C
  • Support: Technical consultation & logistics coordination
Dowsil EA-4100 Needle-Dispensed Adhesive with Moisture Cure and 250% Elongation for Electronics Encapsulation 0
Recommended Products
Get in touch with us
Contact Person : ouyang
Tel : +86 13510063180
Characters Remaining(20/3000)