Shin-Etsu X-23-8195-4 High Performance Silicone Thermal Grease for CPU GPU Heat Dissipation Interface Material

Shin-Etsu MicroSi X-23-8195-4 is a one-part, solvent-free silicone-based thermal grease filled with spherical ceramic particles (Al₂O₃ and ZnO), formulated as a non-electrically conductive Thermal Interface Material (TIM) for semiconductor heat dissipation.

Developed as an evolution of earlier Shin-Etsu OEM pastes (X-23-7921-5 / X-23-7783D), the X-23-8195-4 features thixotropic medium viscosity and tightly controlled filler particle size distribution, allowing it to be spread into an extremely thin, stable bond line between a processor IHS/die and its heatsink. It exhibits minimal pump-out tendency, low bleed, and stable long-term thermal performance under cyclic heating—qualities that made it a popular choice in OEM server and high-end consumer cooling applications before it entered the retail market.

The X-23-8195-4 is engineered for industrial reliability: its spherical ceramic fillers permit a minimum achievable Bond Line Thickness (BLT) of ~14–17 µm under typical mounting pressure (tested at 9 N/cm² by igor'sLAB), yielding a low interface thermal resistance (~4.4–5.2 mm²·K/W). The paste is electrically insulating, contains no volatile solvents (volatile content <0.15% @150°C/24h), and resists siloxane outgassing and phase separation—making it suitable for clean-room and repeated thermal cycling environments.

• Originally designed for BGA packages, GPUs, flip-chip dies and lidded processors, the X-23-8195-4 is widely used in:
  Desktop/NB CPU & GPU cooling (between IHS and heatsink base)
• Server / data-center processor thermal management
• Automotive ECU and power module heat dissipation
• Industrial semiconductor devices requiring thin-BLT, non-conductive TIM