ELECTROLUBE Launches High-Performance Non-Silicone Thermal Paste HTCP, Delivering Superior Thermal Management for High-R

ELECTROLUBE, a global leader in specialist chemical solutions for electronics, announced the full market availability of its high-performance, non-silicone thermal paste, HTCP (Heat Transfer Compound Plus). Engineered to address the thermal management challenges of high-power-density electronic components, HTCP offers an efficient and reliable thermal interface material (TIM) solution through its superior thermal conductivity and unique silicone-free formulation. It is ideally suited for mission-critical applications such as data centers, new energy vehicles, industrial drives, and telecommunications equipment, where reliability is paramount.

HTCP is a highly thermally conductive, non-curing paste. Its key advantage lies in its non-silicone oil base. Traditional silicone-based pastes carry the risk of low molecular weight (LMW) siloxane migration under prolonged high-temperature operation. These volatile compounds can contaminate sensitive optical sensors, relay contacts, or high-impedance circuits, leading to device failure. ELECTROLUBE HTCP completely eliminates this risk, making it the ideal choice for applications where silicones are prohibited.

According to the official technical data sheet, HTCP boasts a thermal conductivity of 2.5 W/m.K (measured via the heat flow method), ensuring efficient heat transfer from heat-generating dies (e.g., CPUs, GPUs, IGBT modules) to heat sinks. Its low viscosity (approximately 101-112 Pa·s at 1 rpm) ensures excellent ease of application, allowing for a uniform, thin layer via brushing, spatula, roller, or automated dispensing systems. The datasheet emphasizes that the quality of application is as crucial as the material's thermal conductivity. The non-curing nature of HTCP allows for simple and efficient rework of components when required, significantly simplifying both production and maintenance processes.

"As the power of electronic devices continues to rise, thermal design has become a critical factor determining product longevity and stability," said a spokesperson from ELECTROLUBE's technical department. "Our goal in developing HTCP was to provide customers with a high-reliability solution that delivers top-tier thermal performance while eliminating contamination risks at the material source. Its UL94 V-0 equivalent flammability rating and RoHS-2 compliance also meet stringent environmental and safety standards."

• Power Semiconductors:​ Between the base plate/heatsink of IGBTs, Power MOSFETs, diodes, and thyristors.
• Computing & Storage:​ Between server CPUs/GPUs, AI accelerator chips, and cold plates or heatsinks.
• Automotive Electronics:​ Power modules in electric vehicle motor controllers, On-Board Chargers (OBCs), and Battery Management Systems (BMS).
• Industrial & Energy:​ Thermal management within inverters, UPS systems, and photovoltaic inverters.
• Telecom Equipment:​ Heat dissipation for 5G base station power amplifiers (PAs) and optical modules.

ELECTROLUBE offers a variety of packaging options, from 2ml syringes to 25kg bulk containers (Order Codes: HTCP02S, HTCP20S, HTCP100T, HTCP700G, HTCP01K, HTCP25K), catering to needs ranging from R&D prototyping to large-scale industrial manufacturing.

True to its motto "THE SOLUTIONS PEOPLE," ELECTROLUBE provides a complete thermal management portfolio. Beyond HTCP, this includes standard heat transfer pastes (HTC), high-temperature silicone pastes (HTS), gap fillers (HTCPX), thermal conductive RTVs (TCOR/TCER), thermally conductive epoxy adhesives (TBS), and encapsulation resins (ER2220, UR5633, SC2003), offering a one-stop-shop for thermal management challenges.